The current design sees the RAM placed on top of the SoC, which is slightly less efficient and runs hotter. This informative image helps explain the difference between the two designs; essentially, the new architecture should reduce heat dissipation and speed up communication between the two components.
That results in better performance and power efficiency and also means the vapor cooling system inside Apple’s upcoming pro iPhones can work more efficiently to reduce heat dissipation. While no one knows for sure, some estimates claim this new WMCM packaging should enable 15-20% performance boost, even before we consider the improved efficiency inherent in the new A20 chip.
A huge data heist
All of this information is carried within the 200,000+ files (630GB) World Leaks published on its dark web site. The data also includes confidential Apple supplier list info, detailed information concerning the circuit board, battery parts, and camera modules – even confidential information about which suppliers are competing to supply specific components. These are all confidential trade secrets the company is unlikely to want public, as they give rivals rare insight into how the company’s supply chain is structured.
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